Name: REDMI 17T 5G - 6.59" Dual SIM - Fingerprint - 6500mAh
SKU: 27676
Availability: InStock

Network	Technology	GSM / HSPA / LTE / 5G

Launch	Announced	2026, May 28
Launch	Status	Available. Released 2026, May 28

Body	Dimensions	157.6 x 75.2 x 8.2 mm (6.20 x 2.96 x 0.32 in)
	Weight	200 g (7.05 oz)
	Build	Glass front (Gorilla Glass 7i), plastic frame, glass-fiber reinforced plastic back (Gorilla Glass 7i)
	SIM	· Nano-SIM + Nano-SIM + eSIM + eSIM (max 2 at a time) · Nano-SIM + Nano-SIM
		IP68 dust tight and water resistant (immersible up to 1.5m for 30 min)

Display	Type	AMOLED, 68B colors, 120Hz, 3840Hz PWM, Dolby Vision, HDR10+, 3500 nits (peak)
	Size	6.59 inches, 106.4 cm² (~89.8% screen-to-body ratio)
	Resolution	1268 x 2756 pixels, 19.5:9 ratio (~460 ppi density)
	Protection	Corning Gorilla Glass 7i, Mohs level 5

Platform	OS	Android 16, HyperOS 3
	Chipset	Mediatek Dimensity 8500 Ultra (4 nm)
	CPU	Octa-core (1×3.4 GHz Cortex-A725 & 3×3.2 GHz Cortex-A725 & 4×2.2 GHz Cortex-A725)
	GPU	Mali-G720 MC8

Main Camera

50 MP, f/1.7, 23mm (wide), 1/1.55″, 1.0µm, PDAF (9cm – ∞), OIS

50 MP, f/3.0, 115mm (periscope telephoto), 1/2.76″, 0.64µm, PDAF (30cm – ∞), OIS, 5x optical zoom

12 MP, f/2.2, 15mm, 120˚ (ultrawide), 1/3.06″, 1.12µm

Leica lens, Color spectrum sensor, Ultra HDR, LED flash, HDR, panorama

4K@30/60fps, 1080p@30/60/120/240/960fps, gyro-EIS, 10-bit Rec. 2020, HDR10+, Log

Sound	Loudspeaker	Yes, with stereo speakers (with Dolby Atmos)
	3.5mm jack	No
		24-bit/192kHz Hi-Res & Hi-Res Wireless audio

Comms	WLAN	Wi-Fi 802.11 a/b/g/n/ac/6e, dual-band or tri-band, Wi-Fi Direct
	Bluetooth	6.0, A2DP, LE
	Positioning	GPS (L1+L5), BDS (B1I+B1c+B2a), GALILEO (E1+E5a), QZSS (L1+L5), NavIC (L5), GLONASS
	NFC	Yes (market/region dependent)
	Infrared port	Yes
	Radio	No
	USB	USB Type-C 2.0, OTG